Multi-package system using configurable input/output interface circuits for single-ended intra-package communication and differential inter-package communication

A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.