Molding die and molding method
The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punc...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punch, and the second punch to compression-mold a molding object is formed in the through-hole. An undercut molding part is formed in the surface of the second die facing the cavity. The second die is formed so as to be splittable into two or more split bodies. |
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