Thin film barrier seed metallization in magnetic-plugged through hole inductor

Thin film barrier seed metallization in magnetic-plugged through hole inductor

Embodiments include inductors and methods of forming inductors. In an embodiment, an inductor may include a substrate core and a conductive through-hole through the substrate core. Embodiments may also include a magnetic sheath around the conductive through hole. In an embodiment, the magnetic sheat...

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Bibliographische Detailangaben
Hauptverfasser: Pietambaram, Srinivas, Paital, Sameer, Jain, Rahul, Darmawikarta, Kristof, Zhao, Junnan, Chatterjee, Prithwish, Gaan, Sandeep, Boyapati, Sri Ranga Sai
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Beschreibung
Zusammenfassung:Embodiments include inductors and methods of forming inductors. In an embodiment, an inductor may include a substrate core and a conductive through-hole through the substrate core. Embodiments may also include a magnetic sheath around the conductive through hole. In an embodiment, the magnetic sheath is separated from the plated through hole by a barrier layer. In an embodiment, the barrier layer is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath.