Deposition apparatus

A deposition apparatus may include a chamber, a crucible in the chamber, a cover part covering the crucible, and 2n nozzles (where 'n' is a positive integer number) protruding from the cover part and arranged in a first direction. Among the 2n nozzles, a distance between a n-th nozzle and...

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Bibliographische Detailangaben
Hauptverfasser:	Oh, Suhyun, Park, Kookchol, Noh, Sokwon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus may include a chamber, a crucible in the chamber, a cover part covering the crucible, and 2n nozzles (where 'n' is a positive integer number) protruding from the cover part and arranged in a first direction. Among the 2n nozzles, a distance between a n-th nozzle and a (n+1)-th nozzle may be greater than a distance between a (2n−1)-th nozzle and a 2n-th nozzle.