Exposed wire-bonding for sensing liquid and water in electronic devices
An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor...
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| creator | Bhattacharyya, Manoj K Gider, Savas Horiuchi, James G O'Brien, Patrick E Jiang, Tongbi T Han, Caleb C MacNeil, David Balasubramanian, Ashwin Boozer, Brad G Lee, William S Arndt, Gregory B Solasi, Roham Liang, Jiahui |
| description | An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume. |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRONIC TIME-PIECES HOROLOGY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING |
| title | Exposed wire-bonding for sensing liquid and water in electronic devices |
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