Exposed wire-bonding for sensing liquid and water in electronic devices

An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor...

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Bibliographische Detailangaben
Hauptverfasser:	Bhattacharyya, Manoj K, Gider, Savas, Horiuchi, James G, O'Brien, Patrick E, Jiang, Tongbi T, Han, Caleb C, MacNeil, David, Balasubramanian, Ashwin, Boozer, Brad G, Lee, William S, Arndt, Gregory B, Solasi, Roham, Liang, Jiahui
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRONIC TIME-PIECES HOROLOGY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.