Liquid-cooled water pump flow-split heat dissipation device

A heat dissipation device includes a console box, multiple casings and two flow-spilt assemblies. The casings are vertically superposed on the console box. Each casing has a heat dissipation loop. The two flow-split assemblies are disposed outside the casings. Each flow-split assembly has a water reservoir, a connecting tube communicated between the console box and the water reservoir and multiple curved tubes disposed on the water reservoir. The water reservoir is of a rod shape along a direction of the superposing of the casings. The curved tubes are arranged sequentially and spacedly along the water reservoir to communicate between the water reservoir and each casing correspondingly and connect each of the heat dissipation loops.