Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom

Conductive cap-based approaches for conductive via fabrication is described. In an example, an integrated circuit structure includes a plurality of conductive lines in an ILD layer above a substrate. Each of the conductive lines is recessed relative to an uppermost surface of the ILD layer. A plural...

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Bibliographische Detailangaben

Hauptverfasser:	Tsang, Chi-Hwa, Gstrein, Florian, Han, Eungnak, Hourani, Rami, Nyhus, Paul A, Chandhok, Manish, Wallace, Charles H, Brain, Ruth A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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