Protection from metal migration on IC packages

A mold chase has first and second mold clamps having corresponding teeth and recesses configured such that, when the mold chase is closed onto a sub-assembly having an IC die mounted onto and wire-bonded to a lead frame, there are gaps between the recesses and the leads of the lead frame that allow...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bai, Zhigang, Pang, Xingshou, Yao, Jinzhong
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!