Protection from metal migration on IC packages

A mold chase has first and second mold clamps having corresponding teeth and recesses configured such that, when the mold chase is closed onto a sub-assembly having an IC die mounted onto and wire-bonded to a lead frame, there are gaps between the recesses and the leads of the lead frame that allow...

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Bibliographische Detailangaben
Hauptverfasser:	Bai, Zhigang, Pang, Xingshou, Yao, Jinzhong
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A mold chase has first and second mold clamps having corresponding teeth and recesses configured such that, when the mold chase is closed onto a sub-assembly having an IC die mounted onto and wire-bonded to a lead frame, there are gaps between the recesses and the leads of the lead frame that allow molding compound to extend along opposing sides of proximal ends of the leads to increase the metal-to-metal distance between adjacent leads, thereby reducing the chances of, for example, tin migrating during HAST testing to form undesirable conduction paths between adjacent leads. In some embodiments, the mold clamp teeth have chamfered edges that are tapered at the mold chase cavity to form wedge-shaped gaps that allow the molding compound to extrude along the proximal ends of the leads of MaxQFP packages having two levels of "J" leads and gullwing leads.