Multi-chip packages and sinterable paste for use with thermal interface materials

Multi-chip packages and sinterable paste for use with thermal interface materials

In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a h...

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Bibliographische Detailangaben
Hauptverfasser: Olmoz, David D, Raravikar, Nachiket R, Matayabas, Jr., James C, Sankman, Robert L, Mahajan, Ravindranath V, Hackenberg, Ken P, Mahanta, Nayandeep K
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.