Electronic equipment

A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1). The hea...

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Bibliographische Detailangaben
Hauptverfasser:	Usami, Morio, Shikama, Kazuyuki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1). The heat conduction paths (11) connect the integrated circuit apparatus 5 and the heatsink (21). This structure allows for disposition of a component different from the heatsink (21) on the same side as the integrated circuit apparatus (5), thus ensuring a higher degree of freedom in a component layout.