Substrate treating apparatus and substrate treating system including pin lift mechanism below cooling base and heat plate
Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate that heats the substrate; lift pins that deliver the substrate, a lift pin drive mechanism that causes the lift pins to move upwardly/downwa...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate that heats the substrate; lift pins that deliver the substrate, a lift pin drive mechanism that causes the lift pins to move upwardly/downwardly; a casing that produces a heat treatment atmosphere; and a cooling base plate that suppresses transmission of heat from the heat treating plate. The lift pin drive mechanism is disposed below the cooling base plate. |
|---|