Method for process monitoring with optical inspections
Machine learning approaches provide additional information about semiconductor wafer inspection stability issues that makes it possible to distinguish consequential process variations like process excursions from minor process variations that are within specification. The effect of variable defect o...
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| Zusammenfassung: | Machine learning approaches provide additional information about semiconductor wafer inspection stability issues that makes it possible to distinguish consequential process variations like process excursions from minor process variations that are within specification. The effect of variable defect of interest (DOI) capture rates in the inspection result and the effect of variable defect count on the wafer can be monitored independently. |
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