Method of handling a substrate

A method of aligning a substrate contact material to a substrate material includes determining a hardness of a substrate material. The method further includes matching a hardness of a substrate contact material to the hardness of the substrate material. The method further includes adding the substra...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chuang, Kuo-Sheng, Chou, You-Hua
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of aligning a substrate contact material to a substrate material includes determining a hardness of a substrate material. The method further includes matching a hardness of a substrate contact material to the hardness of the substrate material. The method further includes adding the substrate contact material to a plurality of contact structures of a substrate handling device, wherein the substrate handling device comprises an edge and a planar surface, a first contact structure of the plurality of contact structures extends from the edge, and a second contact structure of the plurality of contact structures extends from the planar surface.