Curable hotmelt silicone composition, encapsulant, film and optical semiconductor device

A curable hot-melt silicone composition exhibits excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape. The curable hot-melt silicone composition contains(A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per mol...

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Bibliographische Detailangaben
Hauptverfasser:	Takeuchi, Shunya, Kobayashi, Akihiko, Inagaki, Sawako, Hayashi, Akito
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A curable hot-melt silicone composition exhibits excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape. The curable hot-melt silicone composition contains(A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per molecule, (B) branched organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, at 0.1 to 5% by mass relative to the total mass of the composition, (C) additive represented by average unit formula (C-1), (D) hydrosilylation catalyst, and (E) silica.