Chamber components with polished internal apertures

Chamber components with polished internal apertures

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Firouzdor, Vahid, Koonce, David, Kanungo, Biraja Prasad, Sun, Jennifer Y
Format: Patent
Sprache:eng
Schlagworte:
BORING
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
TURNING
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Beschreibung
Zusammenfassung:Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.