High-density flip chip package for wireless transceivers

An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.

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Bibliographische Detailangaben
Hauptverfasser:	Chamas, Ibrahim Ramez, Asuri, Bhushan Shanti, Abouzied, Mohamed
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES TRANSMISSION
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Beschreibung
Zusammenfassung:	An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.