Power conversion device including cooling components

The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second he...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Matsuoka, Shogo, Kishiwada, Yu, Kitamura, Yasuhiko, Takahashi, Hiroaki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.