Abrasive articles and methods for forming same

An abrasive article can include a body including a bond material and abrasive particles contained within the bond material. The bond material can include an organic material including a resin, particularly a phenolic resin. A methylene bridge can be present at para or ortho sites of aromatic phenoli...

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Bibliographische Detailangaben
1. Verfasser:	Shi, Zehua
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GRINDING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	An abrasive article can include a body including a bond material and abrasive particles contained within the bond material. The bond material can include an organic material including a resin, particularly a phenolic resin. A methylene bridge can be present at para or ortho sites of aromatic phenolic rings. The bond material can include an average ortho to para substituent ratio for the methylene bridge within a range including at least 1.5:1 and not greater than 9:1, particularly, within a range including at least 3 and not greater than 6.9.