Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nair, Vijay K, Liff, Shawna M, Tomita, Yoshihiro, Falcon, Javier A, Kamgaing, Telesphor, Dogiamis, Georgios C
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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