Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Nair, Vijay K, Liff, Shawna M, Tomita, Yoshihiro, Falcon, Javier A, Kamgaing, Telesphor, Dogiamis, Georgios C
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.