Conductive adhesive and cured product thereof

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particu...

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Bibliographische Detailangaben
Hauptverfasser:	Mafune, Hitoshi, Matsuo, Kanako
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature.The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.:component (A): an alicyclic epoxy resin;component (B): a boron-based thermal cationic initiator; andcomponent (C): a conductive filler.