Systems and methods for altering high throughput cutting of sealing elements on packages

Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods cont...

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Bibliographische Detailangaben
Hauptverfasser:	Miller, Geoffrey Michael, Blackner, Joseph David, Jones, John Marshall, Hawkins, Bryan, Cerda, Jr., Santos
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CONVEYING CUTTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MACHINE TOOLS MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS METAL-WORKING NOT OTHERWISE PROVIDED FOR PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEVERING SHOP CONVEYOR SYSTEMS SOLDERING OR UNSOLDERING STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING UNPACKING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.