Thermal modules for electronic devices

Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being...

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Bibliographische Detailangaben
Hauptverfasser:	Lin, Hung-Ming, Chiou, Lan-Chin, Saroor, Shaheen
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.