Reducing adhesive failure during nanoimprint lithography demolding
Embodiments relate to a method of fabricating a nano-sized structure in a resin element by nanoimprint lithography (NIL). The method reduces adhesive failure during NIL demolding by forming a layer of polymerization inhibiting compound at the interface of the resin element and template. The resin el...
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| creator | Rao, Tingling Lane, Austin |
| description | Embodiments relate to a method of fabricating a nano-sized structure in a resin element by nanoimprint lithography (NIL). The method reduces adhesive failure during NIL demolding by forming a layer of polymerization inhibiting compound at the interface of the resin element and template. The resin element is made with a mixture of a polymerization inhibiting compound (e.g., a perfluorinated compound) and a resin (e.g., a fluorine resin). The method includes aging the resin element to promote migration of the polymerization inhibiting compound to an interface of the resin element with air. The method also includes pressing a surface of a template having a nano-sized pattern onto the surface of the resin element exposed to the air to form the nano-sized structure in the resin element. The method further includes curing the resin element after the nano-sized structure is formed and then removing the template from the resin element. |
| format | Patent |
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The method reduces adhesive failure during NIL demolding by forming a layer of polymerization inhibiting compound at the interface of the resin element and template. The resin element is made with a mixture of a polymerization inhibiting compound (e.g., a perfluorinated compound) and a resin (e.g., a fluorine resin). The method includes aging the resin element to promote migration of the polymerization inhibiting compound to an interface of the resin element with air. The method also includes pressing a surface of a template having a nano-sized pattern onto the surface of the resin element exposed to the air to form the nano-sized structure in the resin element. The method further includes curing the resin element after the nano-sized structure is formed and then removing the template from the resin element.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MATERIALS THEREFOR ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; NANOTECHNOLOGY ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220405&DB=EPODOC&CC=US&NR=11294278B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220405&DB=EPODOC&CC=US&NR=11294278B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Rao, Tingling</creatorcontrib><creatorcontrib>Lane, Austin</creatorcontrib><title>Reducing adhesive failure during nanoimprint lithography demolding</title><description>Embodiments relate to a method of fabricating a nano-sized structure in a resin element by nanoimprint lithography (NIL). 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The method reduces adhesive failure during NIL demolding by forming a layer of polymerization inhibiting compound at the interface of the resin element and template. The resin element is made with a mixture of a polymerization inhibiting compound (e.g., a perfluorinated compound) and a resin (e.g., a fluorine resin). The method includes aging the resin element to promote migration of the polymerization inhibiting compound to an interface of the resin element with air. The method also includes pressing a surface of a template having a nano-sized pattern onto the surface of the resin element exposed to the air to form the nano-sized structure in the resin element. The method further includes curing the resin element after the nano-sized structure is formed and then removing the template from the resin element.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING |
| title | Reducing adhesive failure during nanoimprint lithography demolding |
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