Reducing adhesive failure during nanoimprint lithography demolding

Embodiments relate to a method of fabricating a nano-sized structure in a resin element by nanoimprint lithography (NIL). The method reduces adhesive failure during NIL demolding by forming a layer of polymerization inhibiting compound at the interface of the resin element and template. The resin element is made with a mixture of a polymerization inhibiting compound (e.g., a perfluorinated compound) and a resin (e.g., a fluorine resin). The method includes aging the resin element to promote migration of the polymerization inhibiting compound to an interface of the resin element with air. The method also includes pressing a surface of a template having a nano-sized pattern onto the surface of the resin element exposed to the air to form the nano-sized structure in the resin element. The method further includes curing the resin element after the nano-sized structure is formed and then removing the template from the resin element.