Cutting elements and structures
A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to for...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described. |
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