Adhesive wafer with an integrated release layer

An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Stroebech, Esben, Langhorn, Philip Holler, Hoejstroem, Michael, Sletten, Carsten, Sund, Anders Grove
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.