Package structure

A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconst...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ku, Shih-Chang, Li, Hung-Chi, Hung, Wensen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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