Package structure
A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconst...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate. The connection member has an inclined fluid channel that descends from the inlet to the base plate. The semiconductor device is disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer. The fixing mechanism fixes the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together. |
|---|