Head module, head device, and liquid discharge apparatus

A head module includes: a plurality of heads, a base on which the plurality of heads is arrayed in a head array direction, a plurality of individual heatsinks respectively attached to the plurality of heads, and a common heatsink standing on the base, the common heatsink including a connector therma...

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Bibliographische Detailangaben
Hauptverfasser:	Miyazaki, Takeshi, Kinokuni, Takashi
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A head module includes: a plurality of heads, a base on which the plurality of heads is arrayed in a head array direction, a plurality of individual heatsinks respectively attached to the plurality of heads, and a common heatsink standing on the base, the common heatsink including a connector thermally connected to each of the plurality of individual heatsinks. The connector of the common heatsink is along the head array direction and is adjacent to each of the plurality of individual heatsinks in a direction perpendicular to the head array direction.