Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus

Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus

A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liao, Hsien-Ken, Chen, Wen-Chien, Lim, Martin George, Chen, Lei, Wen, Hai-Hung, Jiang, JengYaw, Chang, Chun-I, Lo, Chiung C, Hong, David, Liang, Jemm Yue
Format: Patent
Sprache:eng
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.