Method of fabricating semiconductor package and semiconductor package

Method of fabricating semiconductor package and semiconductor package

A method of fabricating a semiconductor package includes preparing a panel package including a redistribution substrate, a connection substrate and a plurality of lower semiconductor chips; sawing the panel package to form a plurality of separated strip packages each of which includes the sawed redi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lee, Tae-Young, Kim, Boseong, Kwak, Dongok, Oh, Joonyoung, Song, Sang Sub
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of fabricating a semiconductor package includes preparing a panel package including a redistribution substrate, a connection substrate and a plurality of lower semiconductor chips; sawing the panel package to form a plurality of separated strip packages each of which includes the sawed redistribution substrate, at least two of the lower semiconductor chips, and the sawed connection substrate; and providing a plurality of upper semiconductor chips on one of the strip packages to electrically connect the upper semiconductor chips to the sawed connection substrate.