Rod-based substrate with ringed interconnect layers

Rod-based substrate with ringed interconnect layers

An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, subs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Phun, Florence Su Sin, Tan, Wei Jern, Ng, Kai Chong, Koh, Boon Ping, Nik Zurin, Nik Mohamed Azeim
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.