Conductive polymer composite as plastic solder
There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic component by using a conductive polymeric composite or removabl...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic component by using a conductive polymeric composite or removably securing the first non-metallic component to the one or more non-metallic component by using the conductive polymeric composite, wherein the conductive polymeric composite used in the method comprises a blend of at least one filler material and at least one thermoplastic polymer. |
---|