Conductive polymer composite as plastic solder

There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic component by using a conductive polymeric composite or removabl...

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Bibliographische Detailangaben
Hauptverfasser: Kwok, Sen Wai, Tan, Siew Ting Melissa, Goh, Kuan Eng Johnson, Goh, Kok Hin Henry
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic component by using a conductive polymeric composite or removably securing the first non-metallic component to the one or more non-metallic component by using the conductive polymeric composite, wherein the conductive polymeric composite used in the method comprises a blend of at least one filler material and at least one thermoplastic polymer.