Semiconductor package with a trench portion
A semiconductor package may include a substrate having an upper surface on which a plurality of first pads are disposed and a lower surface on which a plurality of second pads are disposed. The semiconductor package may further include a semiconductor chip disposed on the upper surface of the substr...
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| Zusammenfassung: | A semiconductor package may include a substrate having an upper surface on which a plurality of first pads are disposed and a lower surface on which a plurality of second pads are disposed. The semiconductor package may further include a semiconductor chip disposed on the upper surface of the substrate on which connection electrodes connected to a first set of the plurality of first pads are disposed. The semiconductor package may include an interposer having an upper surface on which a plurality of first connection pads, connected to a second set of the plurality of first pads, and a plurality of second connection pads are disposed. The semiconductor package may further include a plurality of connection terminals disposed on a set of the plurality of second connection pads of the interposer, and a molding material disposed on the upper surface of the substrate. |
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