Quad package with conductive clips connected to terminals at upper surface of semiconductor die

A packaged semiconductor device includes a carrier having a die attach surface, a semiconductor die mounted on the die attach surface and comprising first and second conductive terminals disposed on an upper side, a first clip that extends over the semiconductor die and is electrically connected to the first conductive terminal, a second clip that extends over the semiconductor die and is electrically connected to the second conductive terminal, and an electrically insulating encapsulant body that encapsulates the semiconductor die. An outer end of the first clip is exposed from the encapsulant body and provides a point of external electrical contact for the first conductive terminal. An outer end of the second clip is exposed from the same or a different side face of the encapsulant body as the first clip and provides a point of external electrical contact for the second conductive terminal.