Efficient curative for free radically-crosslinkable polymers

An organic peroxide composition is provided which is liquid or near liquid at 25° C. or a low melting solid and which includes at least one ethylenically unsaturated organic peroxide (i.e., an organic peroxide containing at least one carbon-carbon double bond) and at least one saturated organic pero...

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Bibliographische Detailangaben
Hauptverfasser:	Despotopoulou, Marina, Palys, Leonard H, Dluzneski, Peter R
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	An organic peroxide composition is provided which is liquid or near liquid at 25° C. or a low melting solid and which includes at least one ethylenically unsaturated organic peroxide (i.e., an organic peroxide containing at least one carbon-carbon double bond) and at least one saturated organic peroxide. The organic peroxide composition may further include at least one mono- and/or poly-unsaturated compound and at least one free-radical trap. The organic peroxide can be blended into a polymer such as a powdered or granular polyethylene resin. This peroxide-containing polymer can be used in rotational molding, wherein the polymer is added to a mold which is heated in an oven with rotation, thereby melting the polymer and coating the inside of the mold.