Coaxial socket of impedance matching structure for semiconductor chip testing and manufacturing method thereof

The present invention relates to a coaxial socket of an impedance matching structure for semiconductor chip testing and a manufacturing method thereof. The coaxial socket includes a test socket locating substrate, a test socket body, a test socket cover, and a test probe. A polymer I and a polymer II are installed and fastened in the test socket body and the test socket cover respectively. A probe slot I and a probe slot II are provided in the polymer I and the polymer II respectively. The test probe is inserted through the probe slot I and the probe slot II. In the present invention, the test socket body and the test socket cover are made of conductive metal, and single-end impedance matching of 50 ohms or differential impedance matching of 100 ohms is performed between them and the probe, to achieve superb signal transmission and heat conduction.