LED packaging unit, LED lamp comprising same, and method of the manufacture same

The present invention is concerned with an LED packaging unit, a manufacturing method for the same, and an LED lamp. The LED packaging unit has a common substrate, N number of red LED chips, M number of green LED chips and X number of blue LED chips. The N number of red LED chips, the M number of gr...

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Bibliographische Detailangaben
Hauptverfasser:	Kang, Guoping, Rodinger, Tomas, Liu, Mingjian
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	The present invention is concerned with an LED packaging unit, a manufacturing method for the same, and an LED lamp. The LED packaging unit has a common substrate, N number of red LED chips, M number of green LED chips and X number of blue LED chips. The N number of red LED chips, the M number of green LED chips and the X number of blue LED chips are arranged and packaged on a bottom surface of a recess of the common substrate. The red LED chips, the green LED chips and the blue LED chips are all monochromatic LED chips, with N, M, and X being integers greater than 1. The distances between any adjacent two red LED chips (or green LED chips or blue LED chips) are substantially consistent.