Mold

The present disclosure relates to a mold improved to tune the position of an insert pin for forming a hole in a molded article. The mold includes a core forming a cavity corresponding to a molded article, a forming plate accommodating the core, and an insert pin configured to penetrate the forming p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Kim, Sang Baek
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates to a mold improved to tune the position of an insert pin for forming a hole in a molded article. The mold includes a core forming a cavity corresponding to a molded article, a forming plate accommodating the core, and an insert pin configured to penetrate the forming plate and the core in a first direction to form a hole in the molded article inside the cavity and be movable along the first direction.