Composition for semiconductor processing and method for polishing substrate using the same

A composition for semiconductor processing comprises: polishing particles; a thiazolinone compound; and a solvent, wherein a logarithmic reduction factor of a microorganism in the composition, as calculated by Formula 1, is at least 4:Logarithmic reduction factor=log(CFU0/CFUx) Formula 1where CFU0...

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Bibliographische Detailangaben
1. Verfasser:	Lee, Hyeongju
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	A composition for semiconductor processing comprises: polishing particles; a thiazolinone compound; and a solvent, wherein a logarithmic reduction factor of a microorganism in the composition, as calculated by Formula 1, is at least 4:Logarithmic reduction factor=log(CFU0/CFUx) Formula 1where CFU0 is an initial concentration (CFU/mL) of the microorganism, CFUx is a concentration (CFU/mL) of the microorganism remaining after standing at room temperature for X days, and X is 1, 2, 3, 4, 5 or 6.