Double patterning method

The present disclosure, in some embodiments, relates to a method of forming an integrated circuit. The method includes forming a first hard mask layer over a substrate and forming a second hard mask layer over the first hard mask layer. The second hard mask layer is patterned to define an island hav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Chia-Ying, Shieh, Jyu-Horng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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