Packaged integrated circuit having stacked die and method for making

A packaged integrated circuit (IC) device includes a first IC die, a first layer of adhesive on a first major surface of the first IC die, and an isolation layer over the first layer of adhesive. The isolation layer has a first major surface and a second major surface, and the second major surface o...

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Bibliographische Detailangaben
Hauptverfasser:	Carpenter, Burton Jesse, Brauchler, Fred T
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES SYSTEMS FOR STORING ELECTRIC ENERGY
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Beschreibung
Zusammenfassung:	A packaged integrated circuit (IC) device includes a first IC die, a first layer of adhesive on a first major surface of the first IC die, and an isolation layer over the first layer of adhesive. The isolation layer has a first major surface and a second major surface, and the second major surface of the isolation layer is between the first layer of adhesive and the first major surface. The packaged IC device also includes a first inductor coil on the first major surface of the isolation layer, a second layer of adhesive on the isolation layer, and a second IC die on the second layer of adhesive.