Adhesive composition, sealing sheet, and sealed body
Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive la...
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| creator | Nishijima, Kenta Hasegawa, Tatsuki |
| description | Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet. |
| format | Patent |
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Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211102&DB=EPODOC&CC=US&NR=11162003B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211102&DB=EPODOC&CC=US&NR=11162003B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nishijima, Kenta</creatorcontrib><creatorcontrib>Hasegawa, Tatsuki</creatorcontrib><title>Adhesive composition, sealing sheet, and sealed body</title><description>Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxTMlILc4sS1VIzs8tyC_OLMnMz9NRKE5NzMnMS1cozkhNLdFRSMxLAQulpigk5adU8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0NDMyMDA2MnI2Ni1AAADBssaw</recordid><startdate>20211102</startdate><enddate>20211102</enddate><creator>Nishijima, Kenta</creator><creator>Hasegawa, Tatsuki</creator><scope>EVB</scope></search><sort><creationdate>20211102</creationdate><title>Adhesive composition, sealing sheet, and sealed body</title><author>Nishijima, Kenta ; Hasegawa, Tatsuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11162003B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>Nishijima, Kenta</creatorcontrib><creatorcontrib>Hasegawa, Tatsuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nishijima, Kenta</au><au>Hasegawa, Tatsuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive composition, sealing sheet, and sealed body</title><date>2021-11-02</date><risdate>2021</risdate><abstract>Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Adhesive composition, sealing sheet, and sealed body |
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