Adhesive composition, sealing sheet, and sealed body

Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive la...

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Bibliographische Detailangaben
Hauptverfasser:	Nishijima, Kenta, Hasegawa, Tatsuki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.