Modular WLCSP die daisy chain design for multiple die sizes

Modular WLCSP die daisy chain design for multiple die sizes

A method to fabricate a modular die daisy chain design for wafer level chip scale package (WLCSP) board level reliability testing is described. A wafer is provided having pairs of solder balls electrically connected to each other by underlying metal pads. The wafer is singulated into dies of any of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Barclay, Duncan, Horsburgh, Edward, Belonio, Jr., Jesus Mennen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method to fabricate a modular die daisy chain design for wafer level chip scale package (WLCSP) board level reliability testing is described. A wafer is provided having pairs of solder balls electrically connected to each other by underlying metal pads. The wafer is singulated into dies of any of a plurality of sizes as required for testing. Thereafter one of the singulated dies is mounted to a test printed circuit board (PCB). The pairs of solder balls are electrically connected in a daisy chain on the test PCB.