Method of forming capped metallized vias
A method of forming an article, including: inserting a conductive material within a via a wafer, wherein the conductive material comprises a first alloy comprising a first metal and a second metal; and contacting the conductive material with a solution comprising ions of a third metal, wherein the i...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of forming an article, including: inserting a conductive material within a via a wafer, wherein the conductive material comprises a first alloy comprising a first metal and a second metal; and contacting the conductive material with a solution comprising ions of a third metal, wherein the ions of the third metal galvanically displace a portion of the second metal from the first alloy to form a second alloy with the first metal. |
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