Technologies for densely packaging network components for large scale indirect topologies

Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switch...

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Bibliographische Detailangaben
Hauptverfasser:	Borch, Eric R, Dischler, Richard J, Flajslik, Mario, Parker, Michael A
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION WIRELESS COMMUNICATIONS NETWORKS
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Beschreibung
Zusammenfassung:	Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.